Difference between revisions of "NXP LPCXpresso860-MAX"

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(Created page with "450px|right This article describes specifics for the NXP LPCXpresso860-MAX evaluation board. __TOC__ <br clear=all> == Preparing for J-Lin...")
 
 
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[[File:NXP_LPCXpresso860-MAX.jpg|450px|right]]
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[[File:NXP_LPCXpresso860-MAX.jpg|thumb|450px|right|NXP LPCXpresso860-MAX evaluation board top side view]]
 
This article describes specifics for the NXP LPCXpresso860-MAX evaluation board.
 
This article describes specifics for the NXP LPCXpresso860-MAX evaluation board.
   
 
__TOC__
 
__TOC__
<br clear=all>
 
   
 
== Preparing for J-Link ==
 
== Preparing for J-Link ==
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== Example Project==
 
== Example Project==
 
TBD
 
TBD
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The following example project was created with the SEGGER Embedded Studio project wizard and runs out-of-the-box on the NXP LPCXpresso860-MAX.<br>
 
The following example project was created with the SEGGER Embedded Studio project wizard and runs out-of-the-box on the NXP LPCXpresso860-MAX.<br>
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*Embedded Studio: V7.10a
 
*Embedded Studio: V7.10a
 
*Link: [[File:VENDOR_DEVICENAME_TestProject_ES_V452b.zip]]
 
*Link: [[File:VENDOR_DEVICENAME_TestProject_ES_V452b.zip]]
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Latest revision as of 10:40, 20 September 2023

NXP LPCXpresso860-MAX evaluation board top side view

This article describes specifics for the NXP LPCXpresso860-MAX evaluation board.

Preparing for J-Link

Example Project

TBD -->