Difference between revisions of "TI LP-CC1311P3"
(→Preparing for J-Link) |
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The following example project was created with the SEGGER Embedded Studio project wizard and runs out-of-the-box on the [SiliconVendor] [EvalBoardName].<br>It is a simple Hello World sample linked into the internal flash.<br> |
The following example project was created with the SEGGER Embedded Studio project wizard and runs out-of-the-box on the [SiliconVendor] [EvalBoardName].<br>It is a simple Hello World sample linked into the internal flash.<br> |
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====SETUP==== |
====SETUP==== |
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| − | *J-Link software: |
+ | *J-Link software: V7.88g |
| − | *Embedded Studio: |
+ | *Embedded Studio: V6.34 |
*Hardware: [SiliconVendor] [EvalBoardName] |
*Hardware: [SiliconVendor] [EvalBoardName] |
||
| − | *Link: [[File: |
+ | *Link: [[File:TI_LP-C1311P3_CC1311P3_TestProject_ES_V634.zip]] |
Revision as of 11:29, 13 June 2023
This article describes specifics for the TI Launchpad CC1311P3 evaluation board.
Preparing for J-Link
- Connect the J-Link to Target In
- Power the board via USB
- Verify the Connection with e.g. J-Link Commander. The output should look as follows:
[PICTURE OF CONNECT]
Example Project
The following example project was created with the SEGGER Embedded Studio project wizard and runs out-of-the-box on the [SiliconVendor] [EvalBoardName].
It is a simple Hello World sample linked into the internal flash.
SETUP
- J-Link software: V7.88g
- Embedded Studio: V6.34
- Hardware: [SiliconVendor] [EvalBoardName]
- Link: File:TI LP-C1311P3 CC1311P3 TestProject ES V634.zip
